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Bt137-800e 4q triac

BT137-800E
TO-220AB
Rev. 4 — 25 March 2011
Product data sheet
Product profile
1.1 General description
Planar passivated sensitive gate four quadrant triac in a SOT78 plastic package intended for use in general purpose bidirectional switching and phase control applications. This sensitive gate "series E" triac is intended to be interfaced directly to microcontrollers, logic integrated circuits and other low power gate trigger circuits.
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
Quick reference data
Parameter
Conditions
NXP Semiconductors
BT137-800E
Quick reference data …continued
Parameter
Conditions
Static characteristics
Pinning information
Pinning information
Description
Simplified outline
Graphic symbol
SOT78 (TO-220AB)
Ordering information
Ordering information
Type number
Description
plastic single-ended package; heatsink mounted; 1 mounting All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 25 March 2011
NXP Semiconductors
BT137-800E
Limiting values
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Parameter
Conditions
IT = 12 A; IG = 0.2 A; dIG/dt = 0.2 A/µs; IT = 12 A; IG = 0.2 A; dIG/dt = 0.2 A/µs; IT = 12 A; IG = 0.2 A; dIG/dt = 0.2 A/µs; IT = 12 A; IG = 0.2 A; dIG/dt = 0.2 A/µs; RMS on-state current as a function of mounting
RMS on-state current as a function of surge
base temperature; maximum values
duration; maximum values
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 25 March 2011
NXP Semiconductors
BT137-800E
Total power dissipation as a function of RMS on-state current; maximum values
tp ≤ 20 ms(1) dIT/dt limit(2) T2- G+ quadrant limit Non-repetitive peak on-state current as a function of pulse width; maximum values
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 25 March 2011
NXP Semiconductors
BT137-800E
Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
Thermal characteristics
Thermal characteristics
Parameter
Conditions
Transient thermal impedance from junction to mounting base as a function of pulse width
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 25 March 2011
NXP Semiconductors
BT137-800E
Characteristics
Characteristics
Parameter
Conditions
Static characteristics
Dynamic characteristics
gate-controlled turn-on ITM = 12 A; VD = 800 V; IG = 0.1 mA; All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 25 March 2011
NXP Semiconductors
BT137-800E
Normalized gate trigger current as a function of
Normalized latching current as a function of
junction temperature
junction temperature
Vo = 1.264 V Rs = 0.038 Ω(1) Tj = 125 °C; typical values(2) Tj = 125 °C; maximum values(3) Tj = 25 °C; maximum values Normalized holding current as a function of
Fig 10. On-state current as a function of on-state
junction temperature
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 25 March 2011
NXP Semiconductors
BT137-800E
Fig 11. Normalized gate trigger voltage as a function of junction temperature
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 25 March 2011
NXP Semiconductors
BT137-800E
Package outline
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB
DIMENSIONS (mm are the original dimensions)
Notes
1. Lead shoulder designs may vary.
2. Dimension includes excess dambar.
REFERENCES
EUROPEAN
ISSUE DATE
PROJECTION
Fig 12. Package outline SOT78 (TO-220AB)
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 25 March 2011
NXP Semiconductors
BT137-800E
Revision history
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
Various changes to content.
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 25 March 2011
NXP Semiconductors
BT137-800E
Legal information
Data sheet status
Document status
Product status
Definition
This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
Definitions
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
Draft — The document is a draft version only. The content is still under
safety-critical systems or equipment, nor in applications where failure or internal review and subject to formal approval, which may result in malfunction of an NXP Semiconductors product can reasonably be expected modifications or additions. NXP Semiconductors does not give any to result in personal injury, death or severe property or environmental representations or warranties as to the accuracy or completeness of damage. NXP Semiconductors accepts no liability for inclusion and/or use of information included herein and shall have no liability for the consequences of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Short data sheet — A short data sheet is an extract from a full data sheet
Quick reference data — The Quick reference data is an extract of the
with the same product type number(s) and title. A short data sheet is intended product data given in the Limiting values and Characteristics sections of this for quick reference only and should not be relied upon to contain detailed and document, and as such is not complete, exhaustive or legally binding.
full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales Applications — Applications that are described herein for any of these
office. In case of any inconsistency or conflict with the short data sheet, the products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
Customers are responsible for the design and operation of their applications NXP Semiconductors and its customer, unless NXP Semiconductors and and products using NXP Semiconductors products, and NXP Semiconductors customer have explicitly agreed otherwise in writing. In no event however, accepts no liability for any assistance with applications or customer product shall an agreement be valid in which the NXP Semiconductors product is design. It is customer’s sole responsibility to determine whether the NXP deemed to offer functions and qualities beyond those described in the Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their Disclaimers
Limited warranty and liability — Information in this document is believed to
NXP Semiconductors does not accept any liability related to any default, be accurate and reliable. However, NXP Semiconductors does not give any damage, costs or problem which is based on any weakness or default in the representations or warranties, expressed or implied, as to the accuracy or customer’s applications or products, or the application or use by customer’s completeness of such information and shall have no liability for the third party customer(s). Customer is responsible for doing all necessary consequences of use of such information.
testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and In no event shall NXP Semiconductors be liable for any indirect, incidental, the products or of the application or use by customer’s third party punitive, special or consequential damages (including - without limitation - lost customer(s). NXP does not accept any liability in this respect.
profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such Limiting values — Stress above one or more limiting values (as defined in
damages are based on tort (including negligence), warranty, breach of the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in Notwithstanding any damages that customer might incur for any reason the Recommended operating conditions section (if present) or the whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards Characteristics sections of this document is not warranted. Constant or customer for the products described herein shall be limited in accordance repeated exposure to limiting values will permanently and irreversibly affect with the Terms and conditions of commercial sale of NXP Semiconductors.
the quality and reliability of the device.
Right to make changes — NXP Semiconductors reserves the right to make
Terms and conditions of commercial sale — NXP Semiconductors
changes to information published in this document, including without products are sold subject to the general terms and conditions of commercial limitation specifications and product descriptions, at any time and without sale, as published at http://www.nxp.com/profile/terms, unless otherwise notice. This document supersedes and replaces all information supplied prior agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 25 March 2011
NXP Semiconductors
BT137-800E
agreement shall apply. NXP Semiconductors hereby expressly objects to product for such automotive applications, use and specifications, and (b) applying the customer’s general terms and conditions with regard to the whenever customer uses the product for automotive applications beyond purchase of NXP Semiconductors products by customer.
NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any No offer to sell or license — Nothing in this document may be interpreted or
liability, damages or failed product claims resulting from customer design and construed as an offer to sell products that is open for acceptance or the grant, use of the product for automotive applications beyond NXP Semiconductors’ conveyance or implication of any license under any copyrights, patents or standard warranty and NXP Semiconductors’ product specifications.
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may
Trademarks
be subject to export control regulations. Export might require a prior authorization from national authorities.
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
the product is not suitable for automotive use. It is neither qualified nor tested FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
in accordance with automotive testing or application requirements. NXP ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
Semiconductors accepts no liability for inclusion and/or use of QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
non-automotive qualified products in automotive equipment or applications.
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
In the event that customer uses the product for design-in and use in HD Radio and HD Radio logo — are trademarks of iBiquity Digital
automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the 10. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 25 March 2011
NXP Semiconductors
BT137-800E
11. Contents
Please be aware that important notices concerning this document and the product(s)described herein, have been included in section ‘Legal information’. NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.comFor sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 March 2011
Document identifier: BT137-800E

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